Experimental study on formability of bulk metallic glass as mold for microstructure replication

	Experimental study on formability of bulk metallic glass as mold for microstructure replication
	Mei L.; Liu J. B.; Huang Y. J.; Lin J.; Shen J.; Tan J. B.; Jin P.
	2012
发表期刊	Microelectronic Engineering
ISSN	0167-9317
卷号	98 页码:142-146
摘要	La(62)Al(14)Cu(12)Ni(12)BMG is introduced as a substitute for silicon which was widely used as mold material for nanofabrication. For the purpose of precise microstructure replication and complete filling, effects of various imprint parameters, including imprint temperature, imprint time and compression load, on formability of La(62)Al(14)Cu(12)Ni(12)BMG are studied and discussed. Scanning electron microscope images and results of thermal analysis are used to characterize the filling effect of La(62)Al(14)Cu(12)Ni(12)BMG. In particular, correlations between time and thermodynamic properties are presented. Despite of its high viscosity at crystallization temperature and its narrow supercooled liquid region, La(62)Al(14)Cu(12)Ni(12)BMG is proved to be a durable and promising material which can precisely replicate the patterns of silicon mold and then transfer its own patterns on Ce(69)Al(10)Cu(20)Co(1)BMG and PMMA. (C) 2012 Elsevier B.V. All rights reserved.
收录类别	SCI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/34354
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Mei L.,Liu J. B.,Huang Y. J.,et al. Experimental study on formability of bulk metallic glass as mold for microstructure replication[J]. Microelectronic Engineering,2012,98:142-146.
APA	Mei L..,Liu J. B..,Huang Y. J..,Lin J..,Shen J..,...&Jin P..(2012).Experimental study on formability of bulk metallic glass as mold for microstructure replication.Microelectronic Engineering,98,142-146.
MLA	Mei L.,et al."Experimental study on formability of bulk metallic glass as mold for microstructure replication".Microelectronic Engineering 98(2012):142-146.