CIOMP OpenIR
Thermal analysis model correction method based on Latin hypercube sampling and coordinate rotation method
S. Li; L. Chen and S. Liu
2023
发表期刊Journal of Thermal Stresses
ISSN01495739
卷号46期号:9页码:857-870
摘要To predict on-orbit temperatures of the spacecraft accurately, a correction method for the thermal analysis model is proposed that combines Latin hypercube sampling and the coordinate rotation method. First, the thermal design parameters to be corrected are determined. Second, the thermal design parameters are sampled by the Latin hypercube sampling, and the sampling results inputted to the I-deas/TMG software for the thermal simulation calculation. Then according to the results of thermal simulation, the thermal design parameters are classified using the Spearman rank correlation coefficient formula, as either global sensitive parameters, local sensitive parameters, or insensitive parameters. Finally, according to the layered correction idea, the above parameters are corrected by the coordinate rotation method to find the optimal solution that satisfies the objective function. After the correction, the maximum temperature difference between the thermal simulation and the thermal balance test for each temperature measurement point is less than 1 °C for high-temperature conditions, and a maximum temperature difference of less than 2 °C for low-temperature condition. © 2023 Taylor & Francis Group, LLC.
DOI10.1080/01495739.2023.2219284
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收录类别sci ; ei
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文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/67638
专题中国科学院长春光学精密机械与物理研究所
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S. Li,L. Chen and S. Liu. Thermal analysis model correction method based on Latin hypercube sampling and coordinate rotation method[J]. Journal of Thermal Stresses,2023,46(9):857-870.
APA S. Li,&L. Chen and S. Liu.(2023).Thermal analysis model correction method based on Latin hypercube sampling and coordinate rotation method.Journal of Thermal Stresses,46(9),857-870.
MLA S. Li,et al."Thermal analysis model correction method based on Latin hypercube sampling and coordinate rotation method".Journal of Thermal Stresses 46.9(2023):857-870.
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