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Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device
Tian, C.; S.-x. Guo; J.-q. Liang; Z.-z. Liang and F.-l. Gao
2017
Source PublicationOptoelectronics Letters
Volume13Issue:4
AbstractThis paper describes a novel finite element thermal analysis model for an AlGaInP-LED micro-array device. We also conduct a transient analysis for the internal temperature field distribution of a 55 array device when a 33 unit is driven by pulse current. In addition, for broader applications, a simplified thermal analysis model is introduced and its accuracy is verified. The internal temperature field distribution of 100100 units is calculated using the simplified model. The temperature at the device center reaches 360.6 C after 1.5 s. In order to solve the heat dissipation problem of the device, an optimized heat dissipation structure is designed, and the effects of the number and size of the heat dissipation fins on the thermal characteristics of the device are analyzed. 2017, Tianjin University of Technology and Springer-Verlag GmbH Germany.
Indexed Bysci ; ei
Language英语
Document Type期刊论文
Identifierhttp://ir.ciomp.ac.cn/handle/181722/59220
Collection中科院长春光机所知识产出
Recommended Citation
GB/T 7714
Tian, C.,S.-x. Guo,J.-q. Liang,et al. Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device[J]. Optoelectronics Letters,2017,13(4).
APA Tian, C.,S.-x. Guo,J.-q. Liang,&Z.-z. Liang and F.-l. Gao.(2017).Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device.Optoelectronics Letters,13(4).
MLA Tian, C.,et al."Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device".Optoelectronics Letters 13.4(2017).
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