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Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device
Tian, C.; S.-x. Guo; J.-q. Liang; Z.-z. Liang and F.-l. Gao
2017
发表期刊Optoelectronics Letters
卷号13期号:4
摘要This paper describes a novel finite element thermal analysis model for an AlGaInP-LED micro-array device. We also conduct a transient analysis for the internal temperature field distribution of a 55 array device when a 33 unit is driven by pulse current. In addition, for broader applications, a simplified thermal analysis model is introduced and its accuracy is verified. The internal temperature field distribution of 100100 units is calculated using the simplified model. The temperature at the device center reaches 360.6 C after 1.5 s. In order to solve the heat dissipation problem of the device, an optimized heat dissipation structure is designed, and the effects of the number and size of the heat dissipation fins on the thermal characteristics of the device are analyzed. 2017, Tianjin University of Technology and Springer-Verlag GmbH Germany.
收录类别sci ; ei
语种英语
文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/59220
专题中科院长春光机所知识产出
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Tian, C.,S.-x. Guo,J.-q. Liang,et al. Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device[J]. Optoelectronics Letters,2017,13(4).
APA Tian, C.,S.-x. Guo,J.-q. Liang,&Z.-z. Liang and F.-l. Gao.(2017).Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device.Optoelectronics Letters,13(4).
MLA Tian, C.,et al."Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device".Optoelectronics Letters 13.4(2017).
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