CIOMP OpenIR  > 中科院长春光机所知识产出
Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor
Mao, S.; J. Liu and B. Ge
2017
Source PublicationHanjie Xuebao/Transactions of the China Welding Institution
Volume38Issue:3
AbstractWith the use of Pb in a variety of occasions prohibited, Lead-free technology becomes one of important research direction. For understanding the fatigue properties of lead-free solder, there is important significance to analyse fanalyse state of lead-free solders and to research on the method of testing. With the 0805 chip capacitor device package solder joints as the research object, Sn96.5/Ag3/Cu0.5 solder joints finite element model is established for multi period under temperature cycles. And shearing test is carried out. The value of Period-shearing stress to Sn96.5/Ag3/Cu0.5 and Sn63/Pb37 solders is obtained. Thermal fatigue fitting curves of solder in 1500 periods is acquired, by using nonlinear least square method to fit curves. The results indicates that under the stipulated test condition, in limited 1500 periods, thermal fatigue performance of Sn96.5/Ag3/Cu0.5 solder joints' rate of thermal fatigue deterioration to 0805 capacitance is slightly slower than that of Sn63/Pb37 solder joints. 2017, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
Indexed Byei
Language中文
Document Type期刊论文
Identifierhttp://ir.ciomp.ac.cn/handle/181722/59135
Collection中科院长春光机所知识产出
Recommended Citation
GB/T 7714
Mao, S.,J. Liu and B. Ge. Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor[J]. Hanjie Xuebao/Transactions of the China Welding Institution,2017,38(3).
APA Mao, S.,&J. Liu and B. Ge.(2017).Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor.Hanjie Xuebao/Transactions of the China Welding Institution,38(3).
MLA Mao, S.,et al."Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor".Hanjie Xuebao/Transactions of the China Welding Institution 38.3(2017).
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