Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays

	Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays
	Ban, Z.; Z. Z. Liang; J. Q. Liang; W. B. A. Wang; JinguangLv and Y. X. Qin
	2017
发表期刊	Current Optics and Photonics
卷号	1 期号:2
摘要	LED arrays with pixel numbers of 3x3, 4x4, and 5x5 have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of 280x280 mu m) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the 3x3, 4x4, 5x5 arrays were 52 degrees C/W, 69.7 degrees C/W, and 84.3 degrees C/W. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with 40 mu m pixel pitch and 150 mu m substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaTnP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.
收录类别	sci ; ei
语种	中文
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/58825
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Ban, Z.,Z. Z. Liang,J. Q. Liang,et al. Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays[J]. Current Optics and Photonics,2017,1(2).
APA	Ban, Z.,Z. Z. Liang,J. Q. Liang,W. B. A. Wang,&JinguangLv and Y. X. Qin.(2017).Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays.Current Optics and Photonics,1(2).
MLA	Ban, Z.,et al."Thermal Analysis and Design of AlGaInP-based Light Emitting Diode Arrays".Current Optics and Photonics 1.2(2017).

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