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Packaging-Induced Strain Measurement Based on the Degree of Polarization in GaAsP-GaInP High-Power Diode Laser Bars
其他题名论文其他题名
Wang Y.; Qin L.; Zhang Y.; Tian Z.; Yang Y.; Li Z. J.; Wang C.; Yao D.; Yin H. H.; Liu Y.; Wang L. J.
2009
发表期刊Ieee Photonics Technology Letters
ISSN1041-1135
卷号21期号:14页码:963-965
摘要The strain caused by device packaging was studied in high-power semiconductor laser bars by measuring the degree of polarization. Polarization measurement with intentionally GaAsP-GaInP strained laser bar packaged on a Cu heat sink for 799-nm emission revealed the variation of band edges between the conduction band and heavy-hole or light-hole bands in the active region. This served as a method for evaluating the strain. In the packaging process, a maximum of 1800-ppm strain was transmitted to the active region. It was found that the defect density of 14.3% was induced.
收录类别SCI ; EI
语种英语
文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/26264
专题中科院长春光机所知识产出
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GB/T 7714
Wang Y.,Qin L.,Zhang Y.,et al. Packaging-Induced Strain Measurement Based on the Degree of Polarization in GaAsP-GaInP High-Power Diode Laser Bars[J]. Ieee Photonics Technology Letters,2009,21(14):963-965.
APA Wang Y..,Qin L..,Zhang Y..,Tian Z..,Yang Y..,...&Wang L. J..(2009).Packaging-Induced Strain Measurement Based on the Degree of Polarization in GaAsP-GaInP High-Power Diode Laser Bars.Ieee Photonics Technology Letters,21(14),963-965.
MLA Wang Y.,et al."Packaging-Induced Strain Measurement Based on the Degree of Polarization in GaAsP-GaInP High-Power Diode Laser Bars".Ieee Photonics Technology Letters 21.14(2009):963-965.
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