Solder with discontinuous melting point in semiconductor laser arrays and stacks

	Solder with discontinuous melting point in semiconductor laser arrays and stacks
其他题名	论文其他题名
	Cheng D. M.; Wang L. J.; Liu Y.; Cao Y. L.; Li L. N.; Gao F. B.
	2003
发表期刊	Optics and Laser Technology
ISSN	0030-3992
卷号	35 期号:1 页码:61-63
摘要	High power semiconductor laser arrays must be mounted in the epitaxy-side down configuration for good heat transfer and so require a well-controlled solder. Selection of solder is very important in semiconductor laser arrays and stacks. Usually, the solder consists of two layers. The outer layer prevents In from oxidation. A new type of solder with several layers of Au between the two layers of In was made, which constitutes of multi-layer of W/Ni/Au/In/Cu. In packaging, the An layer in the solder does not melt. Quick temperature decrease can avoid expansion of the solder. The solder cannot oxidize during packaging. (C) 2002 Elsevier Science Ltd. All rights reserved.
收录类别	SCI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/25156
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Cheng D. M.,Wang L. J.,Liu Y.,et al. Solder with discontinuous melting point in semiconductor laser arrays and stacks[J]. Optics and Laser Technology,2003,35(1):61-63.
APA	Cheng D. M.,Wang L. J.,Liu Y.,Cao Y. L.,Li L. N.,&Gao F. B..(2003).Solder with discontinuous melting point in semiconductor laser arrays and stacks.Optics and Laser Technology,35(1),61-63.
MLA	Cheng D. M.,et al."Solder with discontinuous melting point in semiconductor laser arrays and stacks".Optics and Laser Technology 35.1(2003):61-63.

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