Effects of interfacial interaction potential on the sublimation rates of TNT films on a silica surface examined by QCM and AFM techniques

	Effects of interfacial interaction potential on the sublimation rates of TNT films on a silica surface examined by QCM and AFM techniques
其他题名	论文其他题名
	Mu R.; Ueda A.; Liu Y. C.; Wu M.; Henderson D. O.; Lareau R. T.; Chamberlain R. T.
	2003
发表期刊	Surface Science
ISSN	0039-6028
卷号	530 期号:1—2 页码:L293-L296
摘要	The study of 2,4,6-trinitrotoluene (TNT) sublimation rates from the bulk surface and a substrate surface have been evaluated quantitatively with both atomic force microscopy and quartz crystal microbalance (QCM) techniques. A first principle theoretical model is proposed, which allows obtaining three critical parameters, bulk sublimation rate, surface interaction potential, and the effective decay length, with no arbitrary parameters. The bulk sublimation rate predicted by the model is quantitatively confirmed by QCM experiments. The isothermal measurements with QCM showed that the sublimation activation energy of bulk TNT is 131 kJ/mol. More importantly, all results were obtained at one atmosphere and near room temperature. Thus, it should have direct impacts on explosive trace detection device applications. (C) 2003 Elsevier Science B.V. All rights reserved.
收录类别	SCI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/25128
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Mu R.,Ueda A.,Liu Y. C.,et al. Effects of interfacial interaction potential on the sublimation rates of TNT films on a silica surface examined by QCM and AFM techniques[J]. Surface Science,2003,530(1—2):L293-L296.
APA	Mu R..,Ueda A..,Liu Y. C..,Wu M..,Henderson D. O..,...&Chamberlain R. T..(2003).Effects of interfacial interaction potential on the sublimation rates of TNT films on a silica surface examined by QCM and AFM techniques.Surface Science,530(1—2),L293-L296.
MLA	Mu R.,et al."Effects of interfacial interaction potential on the sublimation rates of TNT films on a silica surface examined by QCM and AFM techniques".Surface Science 530.1—2(2003):L293-L296.

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