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Strategy and mechanics for bendable micro-light emitting diode array integrated by polymer 期刊论文
Microelectronic Engineering, 2017, 卷号: 179
作者:  Fang, S. W.;  J. Q. Liang;  Z. Z. Liang;  Y. X. Qin;  J. G. Lv and W. B. Wang
浏览  |  Adobe PDF(1161Kb)  |  收藏  |  浏览/下载：264/99  |  提交时间：2018/06/13
Improving the adhesion of hydrogen silsesquioxane (HSQ) onto various substrates for electron-beam lithography by surface chemical modification 期刊论文
Microelectronic Engineering, 2014, 期号: 128, 页码: 59-65
作者:  Zhang Z. Q.;  Duan H. G.;  Wu Y. H.;  Zhou W. P.;  Liu C.;  Tang Y. G.;  Li H. W.
浏览  |  Adobe PDF(5066Kb)  |  收藏  |  浏览/下载：390/127  |  提交时间：2015/04/24
Experimental study on formability of bulk metallic glass as mold for microstructure replication 期刊论文
Microelectronic Engineering, 2012, 卷号: 98, 页码: 142-146
作者:  Mei L.;  Liu J. B.;  Huang Y. J.;  Lin J.;  Shen J.;  Tan J. B.;  Jin P.
收藏  |  浏览/下载：372/0  |  提交时间：2013/03/27