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Comparative studies on thermal fatigue performance to Sn96.5/Ag3/Cu0.5 solder joints of chip capacitor 期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2017, 卷号: 38, 期号: 3
作者:  Mao, S.;  J. Liu and B. Ge
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Design of anti-shock vibration isolation for detector module of space optics load 期刊论文
Guangxue Jingmi Gongcheng/Optics and Precision Engineering, 2017, 卷号: 25, 期号: 8
作者:  Wang, Z.-S.;  Q.-W. Wu;  Q.-F. Guo;  L. Guo;  F. Jiang and G.-Q. Wang
浏览  |  Adobe PDF(582Kb)  |  收藏  |  浏览/下载:356/117  |  提交时间:2018/06/13