Edge-Enhanced Object-Space Model Optimization of Tomographic Reconstructions for Additive Manufacturing

doi:10.3390/mi14071362

CIOMP OpenIR

	Edge-Enhanced Object-Space Model Optimization of Tomographic Reconstructions for Additive Manufacturing
	Y. Zhang, M. Liu, H. Liu, C. Gao, Z. Jia and R. Zhai
	2023
发表期刊	Micromachines
ISSN	2072666X
卷号	14 期号:7
摘要	Object-space model optimization (OSMO) has been proven to be a simple and high-accuracy approach for additive manufacturing of tomographic reconstructions compared with other approaches. In this paper, an improved OSMO algorithm is proposed in the context of OSMO. In addition to the two model optimization steps in each iteration of OSMO, another two steps are introduced: one step enhances the target regions’ in-part edges of the intermediate model, and the other step weakens the target regions’ out-of-part edges of the intermediate model to further improve the reconstruction accuracy of the target boundary. Accordingly, a new quality metric for volumetric printing, named ‘Edge Error’, is defined. Finally, reconstructions on diverse exemplary geometries show that all the quality metrics, such as VER, PW, IPDR, and Edge Error, of the new algorithm are significantly improved; thus, this improved OSMO approach achieves better performance in convergence and accuracy compared with OSMO. © 2023 by the authors.
DOI	10.3390/mi14071362
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收录类别	sci ; ei
引用统计
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/68209
专题	中国科学院长春光学精密机械与物理研究所
推荐引用方式 GB/T 7714	Y. Zhang, M. Liu, H. Liu, C. Gao, Z. Jia and R. Zhai. Edge-Enhanced Object-Space Model Optimization of Tomographic Reconstructions for Additive Manufacturing[J]. Micromachines,2023,14(7).
APA	Y. Zhang, M. Liu, H. Liu, C. Gao, Z. Jia and R. Zhai.(2023).Edge-Enhanced Object-Space Model Optimization of Tomographic Reconstructions for Additive Manufacturing.Micromachines,14(7).
MLA	Y. Zhang, M. Liu, H. Liu, C. Gao, Z. Jia and R. Zhai."Edge-Enhanced Object-Space Model Optimization of Tomographic Reconstructions for Additive Manufacturing".Micromachines 14.7(2023).

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