Changchun Institute of Optics,Fine Mechanics and Physics,CAS
Go beyond the limit: Rationally designed mixed-dimensional perovskite/semiconductor heterostructures and their applications | |
W. Yu, F. Li, T. Huang, W. Li and T. Wu | |
2023 | |
发表期刊 | Innovation
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ISSN | 26666758 |
卷号 | 4期号:1 |
摘要 | Halide perovskite heterojunctions rationally integrate the chemical and physical properties of multi-dimensional perovskites and judiciously chosen semiconductor materials, offering the promise of going beyond the limit of a single component. This emerging platform of materials innovation offers fresh opportunities to tune material properties, discover interesting phenomena, and enable novel applications. In this review, we first discuss the fundamentals of forming heterojunctions with perovskites and a wide range of semiconductors, and then we give an overview of the research progress of halide perovskite heterojunctions in terms of their optical, electrical, and mechanical properties, focusing on how the heterojunction tunes the energy band structure, electrical transport, and charge recombination behaviors. We further outline the progress of perovskite-based heterojunctions in optoelectronics. Finally, the challenges and future research directions for perovskite/semiconductor heterojunctions are discussed. © 2022 The Author(s) |
DOI | 10.1016/j.xinn.2022.100363 |
URL | 查看原文 |
收录类别 | ei |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.ciomp.ac.cn/handle/181722/68122 |
专题 | 中国科学院长春光学精密机械与物理研究所 |
推荐引用方式 GB/T 7714 | W. Yu, F. Li, T. Huang, W. Li and T. Wu. Go beyond the limit: Rationally designed mixed-dimensional perovskite/semiconductor heterostructures and their applications[J]. Innovation,2023,4(1). |
APA | W. Yu, F. Li, T. Huang, W. Li and T. Wu.(2023).Go beyond the limit: Rationally designed mixed-dimensional perovskite/semiconductor heterostructures and their applications.Innovation,4(1). |
MLA | W. Yu, F. Li, T. Huang, W. Li and T. Wu."Go beyond the limit: Rationally designed mixed-dimensional perovskite/semiconductor heterostructures and their applications".Innovation 4.1(2023). |
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