CIOMP OpenIR
Design of high density modularity TDI CCD imaging system;TDI CCD
Sun, Zhenya; Liu, Dongbin; Fang, Wei; Zhang, Da
2018
发表期刊Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering
ISSN10072276
卷号47期号:6
摘要In order to improve the high density assembly technology of remote sensing camera, a high density TDI CCD imaging system was designed with multichip module technology. First, TDI CCD focal plane with mechanical splicing technology was made to a copied unit. Then, the output energy of CCD output image signals was improved by a transistor emitter follower, they were transmitted to the analog front-end chips. Then they were converted into the 14 bits digital signals. After that they were integrated and processed through field programmable gate array (FPGA). In the end, through TLK2711 high-speed chip they were sent to data acquisition card on the computer. All the driving signals and processing signals of the imaging system were produced by the FPGA. The computer can control the imaging system and exchange the parameter through RS422 communication bus. The experimental results show that the area of driving layout cut down 2/3 than convention design. It realized the camera' s high density assembly adopting the design of the mechanical and electrical integration of heat. And the total data speed can reach 3.6 Gbps in this imaging system, SNR can reach 52.6 dB. 2018, Editorial Board of Journal of Infrared and Laser Engineering. All right reserved.
关键词Computer control systems Cameras Charge coupled devices Data acquisition Field programmable gate arrays (FPGA) Image enhancement Imaging systems Integrated circuit design Multichip modules Remote sensing Thick films
DOI10.3788/IRLA201847.0618001
收录类别EI
引用统计
文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/60616
专题中国科学院长春光学精密机械与物理研究所
推荐引用方式
GB/T 7714
Sun, Zhenya,Liu, Dongbin,Fang, Wei,et al. Design of high density modularity TDI CCD imaging system;TDI CCD[J]. Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering,2018,47(6).
APA Sun, Zhenya,Liu, Dongbin,Fang, Wei,&Zhang, Da.(2018).Design of high density modularity TDI CCD imaging system;TDI CCD.Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering,47(6).
MLA Sun, Zhenya,et al."Design of high density modularity TDI CCD imaging system;TDI CCD".Hongwai yu Jiguang Gongcheng/Infrared and Laser Engineering 47.6(2018).
条目包含的文件 下载所有文件
文件名称/大小 文献类型 版本类型 开放类型 使用许可
Design of high densi(2019KB)期刊论文出版稿开放获取CC BY-NC-SA浏览 下载
个性服务
推荐该条目
保存到收藏夹
查看访问统计
导出为Endnote文件
谷歌学术
谷歌学术中相似的文章
[Sun, Zhenya]的文章
[Liu, Dongbin]的文章
[Fang, Wei]的文章
百度学术
百度学术中相似的文章
[Sun, Zhenya]的文章
[Liu, Dongbin]的文章
[Fang, Wei]的文章
必应学术
必应学术中相似的文章
[Sun, Zhenya]的文章
[Liu, Dongbin]的文章
[Fang, Wei]的文章
相关权益政策
暂无数据
收藏/分享
文件名: Design of high density modularity TDI CCD imag.pdf
格式: Adobe PDF
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。