Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device

	Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device
	Tian, C.; S.-x. Guo; J.-q. Liang; Z.-z. Liang and F.-l. Gao
	2017
发表期刊	Optoelectronics Letters
卷号	13 期号:4
摘要	This paper describes a novel finite element thermal analysis model for an AlGaInP-LED micro-array device. We also conduct a transient analysis for the internal temperature field distribution of a 55 array device when a 33 unit is driven by pulse current. In addition, for broader applications, a simplified thermal analysis model is introduced and its accuracy is verified. The internal temperature field distribution of 100100 units is calculated using the simplified model. The temperature at the device center reaches 360.6 C after 1.5 s. In order to solve the heat dissipation problem of the device, an optimized heat dissipation structure is designed, and the effects of the number and size of the heat dissipation fins on the thermal characteristics of the device are analyzed. 2017, Tianjin University of Technology and Springer-Verlag GmbH Germany.
收录类别	sci ; ei
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/59220
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Tian, C.,S.-x. Guo,J.-q. Liang,et al. Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device[J]. Optoelectronics Letters,2017,13(4).
APA	Tian, C.,S.-x. Guo,J.-q. Liang,&Z.-z. Liang and F.-l. Gao.(2017).Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device.Optoelectronics Letters,13(4).
MLA	Tian, C.,et al."Thermal analysis and an improved heat-dissipation structure design for an AlGaInP-LED micro-array device".Optoelectronics Letters 13.4(2017).

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