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Heat dissipation in high-power semiconductor lasers with heat pipe cooling system
Shu, S. L.; G. Y. Hou; L. J. Wang; S. C. Tian; L. L. Vassiliev and C. Z. Tong
2017
发表期刊Journal of Mechanical Science and Technology
卷号31期号:6
摘要This study focuses on the application of heat pipes in thermal management for high-power semiconductor lasers. The heat pipe cooling systems are used for heat dissipation in high-power semiconductor lasers. These systems are used instead of water cooling machines to realize a compact and lightweight laser module. The n-shaped heat pipe cooling system, which consists of eight 6 mm copper heat pipes with sintered powder wicks, can easily handle a heat load of up to 73 W from a single-laser unit. The fabricated U-shaped heat pipe cooling system, which consists of ten 12 mm copper heat pipes with sintered powder wicks, can easily handle a heat load of up to 300 W from five laser units. The optical power of the multi-laser module cooled by the U-shaped heat pipe cooling system reaches 210 W. These results indicate that high-power semiconductor lasers can be cooled using heat pipe cooling systems instead of water cooling machines.
收录类别sci ; ei
语种英语
文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/59188
专题中科院长春光机所知识产出
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Shu, S. L.,G. Y. Hou,L. J. Wang,et al. Heat dissipation in high-power semiconductor lasers with heat pipe cooling system[J]. Journal of Mechanical Science and Technology,2017,31(6).
APA Shu, S. L.,G. Y. Hou,L. J. Wang,S. C. Tian,&L. L. Vassiliev and C. Z. Tong.(2017).Heat dissipation in high-power semiconductor lasers with heat pipe cooling system.Journal of Mechanical Science and Technology,31(6).
MLA Shu, S. L.,et al."Heat dissipation in high-power semiconductor lasers with heat pipe cooling system".Journal of Mechanical Science and Technology 31.6(2017).
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