Heat dissipation analysis of bendable AlGaInP micro-LED arrays

	Heat dissipation analysis of bendable AlGaInP micro-LED arrays
	Fang, S. W.; W. B. Wang; J. Q. Liang; Z. Z. Liang; Y. X. Qin and J. G. Lv
	2017
发表期刊	Aip Advances
卷号	7 期号:1
摘要	A strategy for fabricating bendable AlGaInP light emitting diode (LED) arrays is presented in this paper. Sample LED arrays with 8 x 8 pixels were fabricated and subjected to bending. Bending only weakly affected the light output power and the current-voltage characteristics of the arrays. LEDarrays suffer from a thermal problem owing to the energy loss during the electrical-to-optical energy conversion. We have designed a three-dimensional heat conduction model for analyzing the effect of the polymer substrate, the configuration of pixels, and the micro-structure on heat dissipation in bendable LED arrays. Thermal conductivity of the polymer substrate critically affected the heat dissipation, suggesting that the substrate thickness should be in the 500-1000 mu m range. A larger pixel distance yielded more distributed heat sources and more uniform temperature distribution. Micro-structured polymer substrates yielded lower temperature, especially for the fins array micro-structure. Based on enhancing the polymer's thermal conductivity and distributing LED pixels, optimizing the substrate's micro-structure is an effective method to improve heat dissipation in bendable LED arrays. Optimized heat dissipation could effectively reduce heat accumulation in LED arrays and alleviate an increase in the junction temperature, allowing to increase the output power of the device. (C) 2017 Author(s).
收录类别	sci ; ei
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/58896
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Fang, S. W.,W. B. Wang,J. Q. Liang,et al. Heat dissipation analysis of bendable AlGaInP micro-LED arrays[J]. Aip Advances,2017,7(1).
APA	Fang, S. W.,W. B. Wang,J. Q. Liang,Z. Z. Liang,&Y. X. Qin and J. G. Lv.(2017).Heat dissipation analysis of bendable AlGaInP micro-LED arrays.Aip Advances,7(1).
MLA	Fang, S. W.,et al."Heat dissipation analysis of bendable AlGaInP micro-LED arrays".Aip Advances 7.1(2017).

条目包含的文件		下载所有文件
文件名称/大小	文献类型	版本类型	开放类型	使用许可
Heat dissipation ana（7163KB）	期刊论文	作者接受稿	开放获取	CC BY-NC-SA	浏览下载