Design of Cu2O-Au composite microstructures for surface-enhanced Raman scattering study

	Design of Cu2O-Au composite microstructures for surface-enhanced Raman scattering study
	Chen, L.; Y. Zhao; Y. J. Zhang; M. M. Liu; Y. X. Wang; X. Qu; Y. Liu; J. Li; X. Y. Liu and J. H. Yang
	2016
发表期刊	Colloids and Surfaces a-Physicochemical and Engineering Aspects
卷号	507
摘要	Octahedral Cu2O-Au composite microstructures (CMSs) were synthesized with a facile in situ method and were attempted as surface-enhanced Raman scattering (SERS) substrates. The density of the Au nanoparticles (NPs) on the surface of the octahedral Cu2O microcrystals,can be controlled by tuning the concentration of the gold precursor, which can further influence the SERS activity of the Cu2O-Au CMSs system. The CMSs system exhibited a charge transfer from Au to Cu2O. Furthermore, metallic NPs deposited on the semiconductor material formed a local electromagnetic field, which altered the interfacial charge distribution. The SERS signal enhancement from the Cu2O-Au CMSs system is attributed to a combination of electromagnetic and chemical enhancement mechanisms occurring simultaneously at the semiconductor-metal interface. Overall, the proposed CMSs system will provide a new model for SERS study and application. (C) 2016 Elsevier B.V. All rights reserved.
文章类型	期刊
收录类别	SCI ; EI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/56865
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Chen, L.,Y. Zhao,Y. J. Zhang,et al. Design of Cu2O-Au composite microstructures for surface-enhanced Raman scattering study[J]. Colloids and Surfaces a-Physicochemical and Engineering Aspects,2016,507.
APA	Chen, L..,Y. Zhao.,Y. J. Zhang.,M. M. Liu.,Y. X. Wang.,...&X. Y. Liu and J. H. Yang.(2016).Design of Cu2O-Au composite microstructures for surface-enhanced Raman scattering study.Colloids and Surfaces a-Physicochemical and Engineering Aspects,507.
MLA	Chen, L.,et al."Design of Cu2O-Au composite microstructures for surface-enhanced Raman scattering study".Colloids and Surfaces a-Physicochemical and Engineering Aspects 507(2016).

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