LED微阵列器件的热学性能分析及热沉结构设计

	LED微阵列器件的热学性能分析及热沉结构设计
其他题名	Thermal Analysis and Heatsink Structural Design of LED Microarray Device
	李贺
学位类型	硕士
导师	王维彪,梁静秋
	2015-10
学位授予单位	中国科学院大学
学位专业	光学工程
关键词	热学特性有限元分析 Led微阵列热沉结构
摘要	LED微阵列芯片利用MOEMS技术在一整块半导体外延片上直接制作出若干规则排列的微小发光单元，形成LED二维微阵列结构。与传统的LED芯片相比微阵列芯片具有集成度高、发光效率高、亮度高等优点，在显示、照明、通讯等领域具有广阔的应用前景.随着LED微阵列芯片单元集成度的提高和功率的增大，芯片的散热问题也变得越来越重要，成为了制约LED微阵列芯片发展的关键因素之一。因此，对LED微阵列芯片的热特性进行分析具有重要的意义。本文针对AlGaInP材料LED微阵列建立了有限元热分析模型，介绍了实体模型建立、网格划分以及边界条件的施加方法。模拟分析了在脉冲电流驱动下，单个单元和3×3单元工作时阵列的温度分布情况。通过计算建立了一种阵列的简化模型，简化后的模型适用于大尺寸阵列温度场分布的计算。结果表明，简化模型与原始模型的温度分布规律基本一致，计算得到的两种模型在工作1.5s时的温度相对误差为0.8%。使用简化模型模拟了含104个单元、尺寸为10mm×10mm×100μm的芯片的温度场分布，工作1.5s时的芯片中心温度已达到360.6℃。为解决其散热问题，设计了两种热沉结构，并对其结构进行了优化，分析了翅片数量、翅片尺寸、粘结材料对芯片温度的影响。
其他摘要	The LED microarray chip with MOEMS technology directly produce a number of regular arrays of tiny light emitting cells on a monolithic semiconductor epitaxial wafer, forming a two-dimensional LED array structure. Compared with the traditional LED chip microchip has the advantages of high integration, high luminous efficiency, high brightness, and has broad application prospects in the fields of display, lighting, communication and so on. With the increasing of the number of LED array chip unit and the power of the device, the heat dissipation of the chip becomes more and more important, and has become one of the key factors which restrict the development of LED microarray chip. Therefore, it is of great significance to analyze the thermal characteristics of LED microarray chip. In this paper, a finite element thermal analysis model is established for the AlGaInP-LED microarray, and the method of the establishment of entity model, the grid division and the boundary conditions are introduced. The temperature distribution of device working with a single unit and 3 × 3 units is respectively analyzed by simulation. The microarray model is simplified by calculating，and the simplified model is more suitable to calculate the temperature field of large size array. The results show that the simplified model is 0.8% at 1.5s. Using the simplified model, the temperature distribution of the chip with the size of 10mm×10mm×100μm and 104 units was calculated, and the center temperature of the chip reached 360.6℃ at 1.5s. In order to solve the problem of heat dissipation, two finned heatsink were designed, and the impacts of heatsink structure, adhesive material, and number of fins on the temperature of chip were simulated.
语种	中文
文献类型	学位论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/49332
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	李贺. LED微阵列器件的热学性能分析及热沉结构设计[D]. 中国科学院大学,2015.

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