Study on the material-remove mechanism of SiC surface polishing

	Study on the material-remove mechanism of SiC surface polishing
	Di F.
	2014
发表期刊	中文 Optics Letters
ISSN	ISBN/16717694
卷号	12
摘要	As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-remove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied.
收录类别	EI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/44415
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Di F.. Study on the material-remove mechanism of SiC surface polishing[J]. 中文 Optics Letters,2014,12.
APA	Di F..(2014).Study on the material-remove mechanism of SiC surface polishing.中文 Optics Letters,12.
MLA	Di F.."Study on the material-remove mechanism of SiC surface polishing".中文 Optics Letters 12(2014).