Changchun Institute of Optics,Fine Mechanics and Physics,CAS
Study on the material-remove mechanism of SiC surface polishing | |
Di F. | |
2014 | |
发表期刊 | 中文 Optics Letters
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ISSN | ISBN/16717694 |
卷号 | 12 |
摘要 | As aerospace technology develops rapidly, higher demand for aerospace optic system is brought forward. With its excellent physical qualities, SiC becomes a very promising material for speculums. The material-remove mechanism of SiC surface polishing is studied, that is, the grinding mechanism of ceramic material. Indentation fracture model is also introduced and is used to explain material-remove mechanism of SiC surface polishing, and the model of SiC polishing in ideal condition is analyzed. Finally, the material-remove mechanism of SiC polishing in real state is studied. |
收录类别 | EI |
语种 | 英语 |
文献类型 | 期刊论文 |
条目标识符 | http://ir.ciomp.ac.cn/handle/181722/44415 |
专题 | 中科院长春光机所知识产出 |
推荐引用方式 GB/T 7714 | Di F.. Study on the material-remove mechanism of SiC surface polishing[J]. 中文 Optics Letters,2014,12. |
APA | Di F..(2014).Study on the material-remove mechanism of SiC surface polishing.中文 Optics Letters,12. |
MLA | Di F.."Study on the material-remove mechanism of SiC surface polishing".中文 Optics Letters 12(2014). |
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