Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass

	Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass
	Zhang H. P.; Jiang Z. H.; Lian J. S.; Hou X. F.
	2007
发表期刊	Transactions of Nonferrous Metals Society of China
ISSN	1003-6326
卷号	17 页码:S736-S740
摘要	Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The results indicate that the copper films have a (I 11) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer (F-S), Mayadas-Shatzkes (M-S) theory and a combined model, the grain boundary reflection coefficient (R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.
收录类别	SCI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/34369
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Zhang H. P.,Jiang Z. H.,Lian J. S.,et al. Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass[J]. Transactions of Nonferrous Metals Society of China,2007,17:S736-S740.
APA	Zhang H. P.,Jiang Z. H.,Lian J. S.,&Hou X. F..(2007).Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass.Transactions of Nonferrous Metals Society of China,17,S736-S740.
MLA	Zhang H. P.,et al."Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass".Transactions of Nonferrous Metals Society of China 17(2007):S736-S740.

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