Changchun Institute of Optics,Fine Mechanics and Physics,CAS
Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass | |
Zhang H. P.; Jiang Z. H.; Lian J. S.; Hou X. F. | |
2007 | |
发表期刊 | Transactions of Nonferrous Metals Society of China
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ISSN | 1003-6326 |
卷号 | 17页码:S736-S740 |
摘要 | Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy (FESEM) and atomic force microscopy (AFM). The results indicate that the copper films have a (I 11) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer (F-S), Mayadas-Shatzkes (M-S) theory and a combined model, the grain boundary reflection coefficient (R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces. |
收录类别 | SCI |
语种 | 英语 |
文献类型 | 期刊论文 |
条目标识符 | http://ir.ciomp.ac.cn/handle/181722/34369 |
专题 | 中科院长春光机所知识产出 |
推荐引用方式 GB/T 7714 | Zhang H. P.,Jiang Z. H.,Lian J. S.,et al. Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass[J]. Transactions of Nonferrous Metals Society of China,2007,17:S736-S740. |
APA | Zhang H. P.,Jiang Z. H.,Lian J. S.,&Hou X. F..(2007).Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass.Transactions of Nonferrous Metals Society of China,17,S736-S740. |
MLA | Zhang H. P.,et al."Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass".Transactions of Nonferrous Metals Society of China 17(2007):S736-S740. |
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