Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon

	Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon
其他题名	论文其他题名
	Jia C. P.; Dong W.; Liu C. X.; Zhang X. D.; Zhou J. R.; Zhong Z. C.; Xue H. L.; Zang H. D.; Xu B. K.; Chen W. Y.
	2006
发表期刊	Microelectronics Journal
ISSN	0026-2692
卷号	37 期号:11 页码:1297-1301
摘要	The present investigation introduces convex corners undercutting and results of rhombus compensation patterns in 40% aqueous KOH solution and in KOH saturated with isopropanol (IPA) solution. All experiments are carried out on (110) silicon at 70 degrees C. Undercuts take place on convex corners in both solutions. Moreover, the front etch planes governing undercut vary with solutions. Rhombus compensations are used to correct the undercut. Perfect acute corner without residue is obtained, and there are only some residue structures on both sides of obtuse convex corners in KOH with IPA solution, which are better results than those in pure aqueous KOH solution. (c) 2006 Elsevier Ltd. All rights reserved.
收录类别	SCI ; EI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/26689
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Jia C. P.,Dong W.,Liu C. X.,et al. Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon[J]. Microelectronics Journal,2006,37(11):1297-1301.
APA	Jia C. P..,Dong W..,Liu C. X..,Zhang X. D..,Zhou J. R..,...&Chen W. Y..(2006).Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon.Microelectronics Journal,37(11),1297-1301.
MLA	Jia C. P.,et al."Convex corners undercutting and rhombus compensation in KOH with and without IPA solution on (110) silicon".Microelectronics Journal 37.11(2006):1297-1301.

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