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Effect of buffer layer thickness and epilayer growth temperature on crystalline quality of InAs0.9Sb0.1 grown by MOCVD
其他题名论文其他题名
Yu S. Z.; Miao G. Q.; Xie J. C.; Jin Y. X.; Zhang T. M.; Song H.; Jiang H.; Li Z. M.
2008
发表期刊Journal of Alloys and Compounds
ISSN0925-8388
卷号466期号:1—2页码:507-511
摘要InAs0.9Sb0.1 epilayers are grown on GaAs (001) substrates by metal organic chemical vapor deposition (MOCVD). In order to relax compressive strain caused by lattice mismatch between InAs0.9Sb0.1 and GaAs, we employ a two-step growth method in which low temperature (430 degrees C) InAs0.9Sb0.1 buffer layers with different thicknesses are introduced into the structure. Effect of the buffer layer thickness and the epdayer's growth temperature on crystalline quality of the epilayer is investigated, respectively. It is clear that there are strip pyramids paralleling with each other on most surface of the samples. The crystalline quality gets well obviously when the buffer layer thickness change from 0 to 50 nm, but it gets worse when the buffer layer thickness increases to 100 nm. It is also shown that the crystalline quality of the epilayer is improved obviously when the epilayer is grown at 500 degrees C, and it gets worse when the growth temperature decreases or increases. (C) 2007 Elsevier B.V. All rights reserved.
收录类别SCI ; EI
语种英语
文献类型期刊论文
条目标识符http://ir.ciomp.ac.cn/handle/181722/26448
专题中科院长春光机所知识产出
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GB/T 7714
Yu S. Z.,Miao G. Q.,Xie J. C.,et al. Effect of buffer layer thickness and epilayer growth temperature on crystalline quality of InAs0.9Sb0.1 grown by MOCVD[J]. Journal of Alloys and Compounds,2008,466(1—2):507-511.
APA Yu S. Z..,Miao G. Q..,Xie J. C..,Jin Y. X..,Zhang T. M..,...&Li Z. M..(2008).Effect of buffer layer thickness and epilayer growth temperature on crystalline quality of InAs0.9Sb0.1 grown by MOCVD.Journal of Alloys and Compounds,466(1—2),507-511.
MLA Yu S. Z.,et al."Effect of buffer layer thickness and epilayer growth temperature on crystalline quality of InAs0.9Sb0.1 grown by MOCVD".Journal of Alloys and Compounds 466.1—2(2008):507-511.
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