High-aspect-ratio metal microchannel plates for microelectronic cooling applications

	High-aspect-ratio metal microchannel plates for microelectronic cooling applications
其他题名	论文其他题名
	Yu W.; Desmulliez M. P. Y.; Drufke A.; Leonard M.; Dhariwal R. S.; Flynn D.; Bognar G.; Poppe A.; Horvath G.; Kohari Z.; Rencz M.
	2010
发表期刊	Journal of Micromechanics and Microengineering
ISSN	0960-1317
卷号	20 期号:2
摘要	A new manufacturing process and the characterization of high-aspect-ratio metal microchannel plates for microelectronic cooling applications are reported in this article. A nickel-based microchannel cooling plate, with channels of width 20 mu m and aspect ratio up to 3.6:1, has been successfully fabricated using a modified UV-LIGA process. Similar metal microstructures, based on electroplated copper, have also been obtained with a width of 15 mu m and an aspect ratio of up to 5:1. In both cases, an over-plate technology was used to electroform the metallic microchannel plates in a single manufacturing step. Hydrodynamic and cooling characteristics of the microchannel plates such as flow rate and heat resistance have been measured. A heat transfer coefficient of 511 W m(-2) K(-1) for a flow rate of 120 l h(-1) has been obtained for the 20 mu m wide nickel-based microchannel.
收录类别	SCI ; EI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/26203
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Yu W.,Desmulliez M. P. Y.,Drufke A.,et al. High-aspect-ratio metal microchannel plates for microelectronic cooling applications[J]. Journal of Micromechanics and Microengineering,2010,20(2).
APA	Yu W..,Desmulliez M. P. Y..,Drufke A..,Leonard M..,Dhariwal R. S..,...&Rencz M..(2010).High-aspect-ratio metal microchannel plates for microelectronic cooling applications.Journal of Micromechanics and Microengineering,20(2).
MLA	Yu W.,et al."High-aspect-ratio metal microchannel plates for microelectronic cooling applications".Journal of Micromechanics and Microengineering 20.2(2010).

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