High-power vertical-cavity surface-emitting lasers bonded with efficient packaging

	High-power vertical-cavity surface-emitting lasers bonded with efficient packaging
其他题名	论文其他题名
	Yan C. L.; Lu G. G.; Qin L.
	2010
发表期刊	Chinese Optics Letters
ISSN	1671-7694
卷号	8 期号:6 页码:595-597
摘要	High-power vertical-cavity surface-emitting lasers (VCSELs) are processed using a wet thermal-selective oxidation technique. The VCSEL chips are packaged by employing three different bonding methods of silver solder, In-Sn solder, and metalized diamond heat spreader. After packaging, optical output power, wavelength shift, and thermal resistance of the devices are measured and compared in an experiment. The device packaged with a metalized diamond heat spreader shows the best operation characteristics among the three methods. The 200-mu m-diameter device bonded with a metalized diamond heat spreader produces a continuous wave optical output power of 0.51 W and a corresponding power density of 1.6 kW/cm(2) at room temperature. The thermal resistance is as low as 10 K/W. The accelerated aging test is also carried out at high temperature under constant current mode. The device operates for more than 1000 h at 70 degrees C, and the total degradation is only about 10%.
收录类别	SCI ; EI
语种	英语
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/26161
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Yan C. L.,Lu G. G.,Qin L.. High-power vertical-cavity surface-emitting lasers bonded with efficient packaging[J]. Chinese Optics Letters,2010,8(6):595-597.
APA	Yan C. L.,Lu G. G.,&Qin L..(2010).High-power vertical-cavity surface-emitting lasers bonded with efficient packaging.Chinese Optics Letters,8(6),595-597.
MLA	Yan C. L.,et al."High-power vertical-cavity surface-emitting lasers bonded with efficient packaging".Chinese Optics Letters 8.6(2010):595-597.

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