Changchun Institute of Optics,Fine Mechanics and Physics,CAS
Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition | |
其他题名 | 论文其他题名 |
Zhang T.; Wu Y. H.; Yang J. C.; Zhang P. | |
2008 | |
发表期刊 | Acta Chimica Sinica |
ISSN | 0567-7351 |
卷号 | 66期号:21页码:2434-2438 |
摘要 | In order to investigate the copper gap-filling during micro electroplating process with additive (N',N'-diethylthiourea), the electrochemical behavior of different electrolyte (without additive, with thiourea or N',N'-diethylthiourea additive) were studied by LSV, CV and SEM, and the electrode kinetics parameters was studied by the Tafei equation. The results show that when N',N'-diethyl thiourea was used during the micro electroplating copper process, activation polarization was generated; metal ion discharge rate was lowered, the overgrowth of fast plating area such as micro-trench edges was restrained; at the same time, activation polarization was increased, thus the crystal nucleus molding speed on the electrode was accelerated; the crystal growth speed was decreased, the plating became flat, and the leveling ability was increased about 50% than that without additive. Furthermore, some micro trenches in the silicon wafer, and the width of 10 mu m and aspect ratio of 4:1, were filled by the micro electroplating process with the additive N',N'-diethylthiourea, however, the electroplating layer had no voids or seams. |
收录类别 | SCI |
语种 | 中文 |
文献类型 | 期刊论文 |
条目标识符 | http://ir.ciomp.ac.cn/handle/181722/25689 |
专题 | 中科院长春光机所知识产出 |
推荐引用方式 GB/T 7714 | Zhang T.,Wu Y. H.,Yang J. C.,et al. Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition[J]. Acta Chimica Sinica,2008,66(21):2434-2438. |
APA | Zhang T.,Wu Y. H.,Yang J. C.,&Zhang P..(2008).Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition.Acta Chimica Sinica,66(21),2434-2438. |
MLA | Zhang T.,et al."Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition".Acta Chimica Sinica 66.21(2008):2434-2438. |
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N_N_二乙基硫脲添加剂对铜微沉积工艺电(950KB) | 开放获取 | -- | 浏览 请求全文 |
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