Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition

	Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition
其他题名	论文其他题名
	Zhang T.; Wu Y. H.; Yang J. C.; Zhang P.
	2008
发表期刊	Acta Chimica Sinica
ISSN	0567-7351
卷号	66 期号:21 页码:2434-2438
摘要	In order to investigate the copper gap-filling during micro electroplating process with additive (N',N'-diethylthiourea), the electrochemical behavior of different electrolyte (without additive, with thiourea or N',N'-diethylthiourea additive) were studied by LSV, CV and SEM, and the electrode kinetics parameters was studied by the Tafei equation. The results show that when N',N'-diethyl thiourea was used during the micro electroplating copper process, activation polarization was generated; metal ion discharge rate was lowered, the overgrowth of fast plating area such as micro-trench edges was restrained; at the same time, activation polarization was increased, thus the crystal nucleus molding speed on the electrode was accelerated; the crystal growth speed was decreased, the plating became flat, and the leveling ability was increased about 50% than that without additive. Furthermore, some micro trenches in the silicon wafer, and the width of 10 mu m and aspect ratio of 4:1, were filled by the micro electroplating process with the additive N',N'-diethylthiourea, however, the electroplating layer had no voids or seams.
收录类别	SCI
语种	中文
文献类型	期刊论文
条目标识符	http://ir.ciomp.ac.cn/handle/181722/25689
专题	中科院长春光机所知识产出
推荐引用方式 GB/T 7714	Zhang T.,Wu Y. H.,Yang J. C.,et al. Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition[J]. Acta Chimica Sinica,2008,66(21):2434-2438.
APA	Zhang T.,Wu Y. H.,Yang J. C.,&Zhang P..(2008).Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition.Acta Chimica Sinica,66(21),2434-2438.
MLA	Zhang T.,et al."Effects of N ',N '-Diethylthiourea on Electrochemical Behavior of Copper Micro-electrodeposition".Acta Chimica Sinica 66.21(2008):2434-2438.

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