Changchun Institute of Optics,Fine Mechanics and Physics,CAS
Solder with discontinuous melting point in semiconductor laser arrays and stacks | |
其他题名 | 论文其他题名 |
Cheng D. M.; Wang L. J.; Liu Y.; Cao Y. L.; Li L. N.; Gao F. B. | |
2003 | |
发表期刊 | Optics and Laser Technology |
ISSN | 0030-3992 |
卷号 | 35期号:1页码:61-63 |
摘要 | High power semiconductor laser arrays must be mounted in the epitaxy-side down configuration for good heat transfer and so require a well-controlled solder. Selection of solder is very important in semiconductor laser arrays and stacks. Usually, the solder consists of two layers. The outer layer prevents In from oxidation. A new type of solder with several layers of Au between the two layers of In was made, which constitutes of multi-layer of W/Ni/Au/In/Cu. In packaging, the An layer in the solder does not melt. Quick temperature decrease can avoid expansion of the solder. The solder cannot oxidize during packaging. (C) 2002 Elsevier Science Ltd. All rights reserved. |
收录类别 | SCI |
语种 | 英语 |
文献类型 | 期刊论文 |
条目标识符 | http://ir.ciomp.ac.cn/handle/181722/25156 |
专题 | 中科院长春光机所知识产出 |
推荐引用方式 GB/T 7714 | Cheng D. M.,Wang L. J.,Liu Y.,et al. Solder with discontinuous melting point in semiconductor laser arrays and stacks[J]. Optics and Laser Technology,2003,35(1):61-63. |
APA | Cheng D. M.,Wang L. J.,Liu Y.,Cao Y. L.,Li L. N.,&Gao F. B..(2003).Solder with discontinuous melting point in semiconductor laser arrays and stacks.Optics and Laser Technology,35(1),61-63. |
MLA | Cheng D. M.,et al."Solder with discontinuous melting point in semiconductor laser arrays and stacks".Optics and Laser Technology 35.1(2003):61-63. |
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